COFAN THERMAL

VAPOR CHAMBERS

Cofan’s vapor chamber is a type of heat spreader used in electronics and other thermal management applications, designed to efficiently distribute heat away from its source to a larger surface area for dissipation.
Structurally, a vapor chamber consists of an enclosure, typically made of metal like copper, which is sealed to maintain an internal vacuum. Inside this enclosure, there is a wick structure made of a porous material that lines the inner walls. This wick aids in the transport of the working fluid, usually a small amount of liquid such as water, which is placed inside the chamber. The vacuum environment allows this liquid to vaporize at lower temperatures.
The operation of a vapor chamber involves several steps. When heat is applied to one side of the chamber, the working fluid at that point absorbs the heat and vaporizes. The vapor then moves to cooler areas within the chamber, where it condenses back into a liquid, releasing the absorbed heat. The condensed liquid is transported back to the heated area by capillary action through the wick structure, completing the cycle.
Cofan’s vapor chambers offer several advantages. They exhibit high thermal conductivity, spreading heat more effectively than solid metal conductors due to the efficient phase change process (liquid to vapor and back). They help maintain a uniform temperature across the surface of the device, preventing hotspots and improving the longevity and performance of electronic components. Despite their efficiency, vapor chambers can be made relatively thin and lightweight, making them suitable for compact electronic devices like smartphones, laptops, and high-performance graphics cards.
These Cofan’s chambers find applications in various fields. In electronics, they are used in CPUs, GPUs, and other components to ensure efficient cooling. In aerospace, they help manage thermal loads in avionics and other spacecraft components. They are also used in LED lighting to dissipate heat generated by high-power LEDs, ensuring longer life and better performance.

- VAPOR CHAMBER

Type: Vapor Chamber
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
Forming, Welding, Annealing
Brand Name:
Cofan Thermal
Material:
Copper
Shape:
As Drawing
Application:
Thermal Management
Size:
90 x 90 x5.50mm
Finish:
Anti Oxidant
Delivery TIme:
4 Weeks L/T

- VAPOR CHAMBER

Type: Vapor Chamber
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
Forming, Welding, Annealing
Brand Name:
Cofan Thermal
Material:
Copper
Shape:
As Drawing
Application:
Thermal Management
Size:
266.50 x 123 x 3.10mm
Finish:
Nickel plating
Delivery TIme:
4 Weeks L/T

- VAPOR CHAMBER

Type: Vapor Chamber
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
Forming, Welding, Annealing
Brand Name:
Cofan Thermal
Material:
Copper
Shape:
As Drawing
Application:
Thermal Management
Size:
136x77x1.6mm
(Vapor Chamber Only)
Finish:
Nickel plating
Delivery TIme:
4 Weeks L/T

− Cofan's Vapor Chambers −

− Cofan's Vapor Chamber Processes −

What are vapor chambers?

A vapor chamber is a planer heat pipe, which can spread heat in two dimensions. They are typically used in high heat flux applications, or when two-dimensional spreading is required. Vapor Chamber technology enables higher CPUs, GPUs and LEDs with a higher TDP (or overclocked state) to be efficiently and effectively cooled to safe operating temperatures, extending component and product life. As shown in the diagram, the vapor chamber features a wicked design that is filled with coolant. When heated, the coolant changes phase from a liquid to a gas and back again to transfer heat.

Benefits of Vapor Chamber

  • Elimination of hot spot
  • Better fin efficiency and equilibrium temperature

Limitations

  • Size: 350 mm x 350 mm
  • Thickiness: 0.5 mm – 5.0 mm
  • Shape: Base on stamping and bending limitation

HEAT PIPE VS. VAPOR CHAMBER

Heat Pipe
VS
Vapor Chamber
Long-distance heat transfer, lightweight, suitable for
large-demand consumer productions
Application
Suitable for large heat plus, high density and high power
system, and a great alternative from liquid cooling
Round, flattened or bent in different directions
Shape
Complex shape in X, Y and Z direction with pedestals
Additional fixture plate/ clamps
Fixture
Through hole in vapor chamber
A base plate required to contact the heat source unless
flattened/ machine direct tough
Course Contact
Direct contact. Mounting pressure up to 90 psi
⌀5 > 20 W; ⌀6 > 40 W; ⌀8 > 60 W
Qmax
T = 5nm > 1500 W; T = 3nm > 500 W;T=1nm > 60 W
Flexible shape in design, low cost, mature supply chain
Advatage
Better anti-gravity result, suppport high power in limited
space, fast spreading, high reliability
Need something special? Talk to our engineers today!
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