STACKED fin /
Zipper FIN HEATSINK
PRODUCTS
Stacked Fin / Zipper Fin Heatsinks – High-Efficiency Thermal Management by Cofan
Cofan’s stacked fin heatsink—also known as a zipper fin heatsink—is a precision-engineered thermal management device designed to dissipate heat from high-performance electronic components. It features multiple thin fins arranged in a stacked configuration on top of a solid base, offering maximum surface area for efficient heat transfer.
These heatsinks are typically made from high thermal conductivity materials such as aluminum or copper and are attached to the base using soldering, welding, mechanical fastening, or thermal adhesives. The result is a compact yet powerful cooling solution suitable for applications where space is limited but thermal performance is critical.
Product Information
- Process: CNC, NCT, Soldering
- Material: Copper
- Application: Thermal Management
- Finish: Anti-oxidant Finish
- Part No: 04.01.00035
Product Information
- Process: CNC, NCT
- Material: Copper
- Application: Thermal Management
- Finish: Anti-oxidant Finish
- Part No: 04.01.00036
Product Information
- Process: CNC, NCT, Soldering
- Material: Base-Aluminum 6063-T5, Fin-Aluminum 1100
- Application: Lighting Fixture
- Finish: Nickel Plating
- Part No: 04.01.00038
Product Information
- Process: CNC, NCT, Soldering
- Material: Base-Aluminum 6063-T5, Fin-Aluminum 1100
- Application: Lighting Fixture
- Finish: Nickel Plating
- Part No: 04.01.00032
Product Information
- Process: CNC, NCT, Soldering
- Material: Base-Aluminum 6063, Fin-Aluminum 1100
- Application: Lighting Fixture
- Finish: Nickel Plating
- Part No: 04.01.00034
− Cofan's Stacked fin heatsink Processes −
Stacked Fin Heatsink
Key Features and Advantages
- Superior Heat Dissipation – Increased surface area accelerates thermal transfer.
- Compact Design – Maintains small footprint while providing maximum cooling capacity.
- Material Flexibility – Available in aluminum, copper, or hybrid designs.
- Custom Engineering – Adaptable to specific thermal, size, and performance needs.
- Durability – Optional anodizing or coating improves corrosion resistance and lifespan.
- Broad Industry Use – Effective across computing, LED lighting, automotive electronics, and power systems.
Manufacturing Process
The production of Cofan’s stacked fin heatsinks involves:
- Fin Fabrication – Individual thin fins are formed through stamping or folding processes.
- Attachment to Base – Using soldering, welding, or adhesives to ensure a strong thermal bond.
- Surface Treatment – Anodizing, plating, or coating to improve thermal conductivity and corrosion resistance.
This method ensures consistent quality, high efficiency, and long-term reliability.
Applications Across Industries
1. Computing & Data Centers
- CPUs: Modern processors generate significant heat due to their high density of transistors. High-performance desktops, servers, and AI systems use stacked fin heatsinks for temperature stability.
- GPUs: Gaming and AI-focused GPUs require intensive cooling. Stacked fin heatsinks, often paired with heat pipes and fans, manage these thermal loads efficiently.
- Networking Equipment: Data centers rely on these heatsinks in routers, switches, and server blades for 24/7 operation.
2. Power Electronics
- Power Transistors & MOSFETs: Used in industrial power supplies, inverters, and amplifiers, where stable operation under load is essential.
- RF & Audio Power Amplifiers: In telecom base stations and high-fidelity audio equipment, stacked fin heatsinks maintain performance and prevent thermal damage.
3. Telecommunications
- RF Power Amplifiers: Cellular base stations use stacked fin heatsinks to cool high-power RF modules, ensuring signal integrity.
- Networking Hardware: Continuous-operation networking gear depends on these heatsinks to prevent performance degradation.
4. LED Lighting
High-Power LEDs: Industrial, commercial, and street lighting fixtures use stacked fin designs to maintain brightness and extend lifespan by preventing overheating.
5. Automotive Electronics
- Electronic Control Units (ECUs): In EVs and hybrids, ECUs and battery management systems (BMS) require precise cooling.
- Power Modules: Critical in propulsion systems and regenerative braking components, where heat management is key to efficiency.
6. Consumer Electronics
- Gaming Consoles: High-performance consoles like PlayStation and Xbox employ stacked fin cooling to handle extended gaming sessions.
- Smart Appliances: Embedded processors in appliances like smart refrigerators and ovens need compact, effective heatsinks.
7. Industrial Equipment & Robotics
- Motor Drives & Inverters: Automation systems use stacked fin cooling to maintain operational reliability.
- Robotics: Actuators and controllers in industrial robots rely on this design for efficient thermal control.
Why Cofan’s Stacked Fin Heatsinks Stand Out
Cofan brings decades of thermal engineering expertise and in-house manufacturing to deliver reliable, high-performance cooling solutions. Our ability to customize designs ensures that each application—whether in computing, automotive, LED lighting, telecom, or industrial systems—receives an optimized heatsink for maximum efficiency and durability.