COFAN THERMAL

STACKED/Zipper FIN HEATSINK

Cofan’s stacked fin heatsink is a thermal management device used to dissipate heat from electronic components. It consists of multiple thin fins arranged in a stacked configuration atop a base. These fins, often made of materials like aluminum or copper, are attached to the base through methods such as soldering, welding, or mechanical fastening. This design maximizes the surface area available for heat transfer while maintaining a compact footprint, making it suitable for applications with limited space.
The manufacturing process involves fabricating individual fins and assembling them onto the base. Various techniques, including soldering, welding, or thermal adhesives, are used to attach the fins securely. Surface treatments such as anodizing or coating may be applied to enhance thermal performance and durability.
Cofan’s stacked fin heatsinks offer several advantages, including high thermal efficiency, compact design, and versatility. They can be customized to meet specific thermal requirements and find applications in various industries, including computers, servers, telecommunications equipment, power supplies, and LED lighting.

- HEAT SINK

Type: Stack Fin Sink
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
CNC, NCT, Soldering
Brand Name:
Cofan Thermal
Material:
Copper
Shape:
As Shown in the Picture
Application:
Thermal Management
Size:
125 x 56 x 48mm
Finish:
Anti-oxidant Finish
Delivery TIme:
4 Weeks L/T

- HEAT SINK

Type: Stack Fin Sink
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
CNC, NCT, Soldering
Brand Name:
Cofan Thermal
Material:
Base: Aluminum 6063-T5, Fin: Aluminum 1100
Shape:
As Shown in the Picture
Application:
Lighting Fixture
Size:
34. x 95 x 13mm
Finish:
Nickel Plating Finish
Delivery TIme:
4 Weeks L/T

- HEAT SINK

Type: Stack Fin Sink
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
CNC, NCT, Soldering
Brand Name:
Cofan Thermal
Material:
Base: Aluminum 6063-T5, Fin: Aluminum 1100
Shape:
As Shown in the Picture
Application:
Lighting Fixture
Size:
145 x 60 x 14mm
Finish:
Nickel Plating Finish
Delivery TIme:
4 Weeks L/T

- HEAT SINK

Type: Stack Fin Sink
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
CNC, NCT, Soldering
Brand Name:
Cofan Thermal
Material:
Base: Aluminum 6063-T5, Fin: Aluminum 1100
Shape:
As Drawing
Application:
Lighting Fixture
Size:
As Drawing
Finish:
Nickel Plating Finish
Delivery TIme:
4 Weeks L/T

− Cofan's Stacked fin heatsink Processes −

Stacked Fin Heatsink

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Cofan’s stacked fin heatsinks are widely used in various applications to manage the thermal load of high-performance electronic components. In computing devices, they cool CPUs and GPUs by increasing surface area for heat dissipation, often in conjunction with fans or liquid cooling for enhanced performance. Power electronics, including transistors and amplifiers, utilize stacked fin heatsinks to maintain efficiency and reliability. In telecommunications, they ensure the stable operation of RF amplifiers and networking equipment. High-power LEDs and automotive electronics, such as electronic control units and power modules, also benefit from these heatsinks, which help prolong component lifespan and maintain optimal performance. The versatility and efficiency of stacked fin heatsinks make them essential in applications requiring effective thermal management in compact and high-demand environments.

1. Computer Devices

  • CPUs (Central Processing Units):

    • Application: Modern CPUs generate significant heat due to their high processing power and density of transistors.
    • Example: High-performance desktops and servers often use stack fin heatsinks to maintain optimal operating temperatures, enhancing performance and longevity.
  • GPUs (Graphics Processing Units):

    • Application: GPUs in gaming, professional workstations, and AI processing units produce considerable heat.
    • Example: Gaming PCs and workstations use advanced stack fin heatsinks often combined with heat pipes and fans for efficient cooling.

2. Power Electronics

  • Power Transistors and MOSFETs:

    • Application: Power transistors in power supplies, inverters, and amplifiers generate heat during operation.
    • Example: Power supplies for industrial machinery or audio amplifiers use stack fin heatsinks to dissipate heat and ensure reliable operation.
  • Power Amplifiers:

    • Application: RF and audio power amplifiers generate significant heat that must be managed to avoid performance degradation.
    • Example: Telecommunication base stations and high-fidelity audio equipment often incorporate stack fin heatsinks.

3. Telecommunications

  • RF Power Amplifiers:

    • Application: RF amplifiers in base stations and communication devices need efficient cooling to maintain signal integrity and performance.
    • Example: Cellular base stations use stack fin heatsinks to cool RF amplifiers and other high-power components.
  • Networking Equipment:

    • Application: Routers, switches, and other networking devices often require thermal management solutions to maintain performance.
    • Example: Data centers employ stack fin heatsinks in their networking hardware to manage heat generated by continuous operation.

4. LED Lighting

  • High-Power LEDs:
    • Application: High-brightness LEDs used in commercial, industrial, and street lighting generate heat that must be dissipated to maintain efficiency and lifespan.
    • Example: LED streetlights and industrial lighting fixtures use stack fin heatsinks to manage thermal loads effectively.

5. Automotive Electronics

  • Electronic Control Units (ECUs):

    • Application: ECUs in vehicles manage various functions like engine control, infotainment, and driver assistance systems, generating heat that needs to be dissipated.
    • Example: Electric vehicles (EVs) use stack fin heatsinks for battery management systems (BMS) and power inverters to ensure stable operation.
  • Power Modules:

    • Application: Power modules in electric and hybrid vehicles generate significant heat during energy conversion and management.
    • Example: EVs and hybrid vehicles employ stack fin heatsinks for cooling power modules involved in propulsion and energy regeneration systems.
6. Consumer Electronics
  • Gaming Consoles:

    • Application: High-performance gaming consoles generate considerable heat due to powerful CPUs and GPUs.
    • Example: Gaming consoles like the PlayStation and Xbox use stack fin heatsinks combined with active cooling solutions to maintain optimal performance during extended gaming sessions.
  • Home Appliances:

    • Application: Modern home appliances with embedded electronics, such as smart refrigerators and microwave ovens, require efficient thermal management.
    • Example: Smart home appliances use stack fin heatsinks to cool their embedded control units and processors.
7. Industrial Equipment
  • Motor Drives and Inverters:

    • Application: Motor drives and inverters in industrial automation systems generate heat during operation.
    • Example: Stack fin heatsinks are used in industrial motor drives to manage heat and ensure continuous, reliable operation.
  • Robotics:

    • Application: Robots in manufacturing and automation have controllers and power electronics that need efficient cooling.
    • Example: Industrial robots use stack fin heatsinks to maintain the performance of their control systems and actuators.
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