COFAN THERMAL

Bonded Fin Heatsink

Cofan’s Bonded-Fin heatsinks are an ideal thermal management solution designed to efficiently dissipate heat from high-power electronic components and systems. These heatsinks are engineered to handle significant thermal loads, making them essential in ensuring the reliability and performance of various electronic devices.
Bonded fin heatsinks are suitable for a broad spectrum of applications, ranging from consumer electronics, such as laptops and gaming consoles, to industrial machinery, medical devices, telecommunications equipment, and military hardware. In these applications, precise thermal management is critical to maintain optimal operating temperatures, prevent overheating, and extend the lifespan of the components.
Cofan’s heatsinks can be custom-designed to meet the specific thermal requirements of both small-scale and large-scale applications. This versatility allows them to address different power levels and device sizes, ensuring effective heat dissipation regardless of the complexity or scale of the thermal challenge.
Moreover, bonded fin heatsinks can be seamlessly integrated with other advanced thermal management technologies to enhance their cooling efficiency further. For instance, combining them with vapor chambers can help spread heat more evenly across the heatsink. Integrating heat pipes can facilitate efficient heat transfer from hotspots to cooler areas, while liquid cooling heat exchangers can provide additional cooling capacity for extremely high-power applications. This adaptability makes bonded fin heatsinks an optimal choice for achieving superior thermal performance across various scenarios.

- HEAT SINK

Type: Bonded Fin
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
Extrusion
Brand Name:
Cofan Thermal
Material:
Copper
Shape:
As Drawing
Application:
Thermal Management
Size:
8"x6"x3.5"
Finish:
Nickel Plating
Delivery TIme:
4 Weeks L/T

- HEAT SINK

Type: Bonded Fin
Brand Name: Cofan Thermal
Place of Origin: Dongguan, China
Application: Thermal Management
Delivery Time: 4 Weeks L/T

- Product Information -

Place of Origin:
Dongguan, China
OEM:
Yes
Process:
CNC, NCT, Soldering
Brand Name:
Cofan Thermal
Material:
Aluminum
Shape:
As Drawing
Application:
Thermal Management
Size:
17"x5.5"3.5"
Finish:
Clear Chromate
Delivery TIme:
4 Weeks L/T

Technology Description

Cofan’s Bonded-Fin heatsinks are an ideal thermal management solution used to dissipate heat from hi-power electronic components and systems.  Bonded fin heatsinks are suitable for a wide range of applications, from consumer electronics to industrial and military equipment, where precise thermal management is critical. They can be designed for both small-scale and large-scale thermal challenges, making them versatile for different power levels and device sizes.  They can be integrated with other thermal management technologies such as vapor chambers, heat pipes, and liquid cooling heat exchangers to further enhance their effectiveness or optimization for a given application.

Bonded fin heatsinks are unique in that they are constructed or manufactured by joining individual heat-radiating fins to a heat-conducting/spreading base plate.  The cooling fins and base plates are typically manufactured separately and then mated together using one of a variety of assembly methods depending on the design application requirements and/or environment. Typical joining techniques may include thermally conductive epoxy, soldering, crimping, or brazing methods.

The method of manufacturing a bonded-fin heatsink allows for several advantages:

  • Improved Thermal Performance: Bonded fin heatsinks can have thinner and more densely packed fins compared to extruded heatsinks, resulting in a larger surface area for heat dissipation.  Additionally, Fin Aspect ratios over 50:1 can be achieved for maximum surface area availability.

  • Design Flexibility: Manufacturers can create custom shapes and sizes to fit specific applications, accommodating various thermal and spatial requirements.

  • Material Options (Custom Shapes and Sizes): Bonded fin heatsinks can be tailored to specific dimensions and shapes to fit unique spatial constraints and thermal requirements. This is especially useful in applications with limited or irregular spaces. Different materials can be used interchangeably for the base and fins such as electrical grade aluminum for its lightweight and thermal conductivity properties, or copper for its superior heat transfer and spreading properties. The ability to use different materials and customize the fin arrangement can lead to more efficient use of materials, potentially reducing costs.

  • Variable heatsink Fin Density and Thickness: The spacing or fin density and orientation of fins can be designed or tailored to maximize airflow and minimize pressure drop resistance, improving the efficiency of both natural and forced convection cooling regimes. The heatsink fin thickness is another variable that can be controlled to optimize thermal performance.

  • Selective heatsink Fin Location: This feature allows for the non-contiguous location of the heatsink fins to be placed in specific areas on the heatsink base.  This allows for clearance areas to be created without having to use subtractive machining processes for fin removal to create hardware access zones and clearance areas.
  • Custom / Enhanced Airflow Paths: The heatsink fin shape and location, or custom airflow deflectors can be designed to direct airflow in specific pathways to enhance cooling efficiency for particular applications.
  • Large Heatsink Format:  Bonded Fin heatsinks can be manufactured up to 60” x 40” (1500mm X 1000mm) in size.
  • Enhanced Thermal Management Options: Bonded fin heatsinks can be easily integrated with fans or blowers to create hybrid cooling solutions, further enhancing thermal management capabilities. They can be further combined with heat pipes or vapor chambers to distribute heat more effectively across the heatsink.

  • Quick Turn Prototyping:  Bonded Fin heatsinks can be prototyped with without hard tooling investment.

Bonded Fin Heatsink Method of Manufacturing Process

Bonded fin heatsinks are manufactured using a process that involves attaching cooling fins to a heat-spreading base using thermal bonding techniques, such as soldering, brazing, or epoxy bonding. Bonded fin heatsink bases are typically manufactured in the following step.

1. Bonded Fin Heatsink Material Selection    

  • Base Material: Typically made from aluminum or copper depending on the thermal spreading requirement. Heat pipes and vapor chambers can be incorporated into the bonded fin base for enhanced thermal conductivity and overall performance improvement.
  • Cooling Fin Material: Often, but not always, the same material as the base (aluminum or copper) to ensure good thermal conductivity and compatibility. CFD analysis is helpful in the selection of the material as it will help to determine the optimum cooling fin thickness, spacing, and efficiency.

2. Bonded Fin Heatsink Base Preparation

In manufacturing bonded fin heatsink bases, the base must first be created with multiple grooves where the cooling fins can be inserted and bonded, brazed, or soldered. There are two primary methods for creating these grooves:

1. Extrusion Process: In this process, the grooves are formed during the extrusion of the base (see Figure 1 below).

2. Machining Process: In this process, the grooves are machined into the base with a CNC machine (See Figure 2 below)

Figure 1

Figure 2

For prototyping or low-volume production, machining the grooves is usually more cost-effective. However, for high-volume production, extruding the grooves is more efficient but incurs some tooling costs.

Each method—machining or extruding the grooves—has its unique advantages. These are summarized in the capabilities chart below.

3. Cooling Fin Preparation

  • Cutting and Forming: Fins are cut and formed from sheets of metal. They may be stamped, extruded, or machined to the required shape and size. This allows for enhanced dissipation features, such as flow-through ventilation, air flow turbulators or disrupters, and serrated fins for enhanced surface area.

4. Assembly and Bonding

  • Placement: The cooling fins are placed into the grooves of the base (for grooved bases) or positioned on the flat base in the desired configuration with the assistance of a jig or fixture.
  • Bonding Methods:
  1. Soldering: Fins and base are heated, and solder is applied to bond the fins to the base. This method provides a strong and thermally conductive bond. There are a variety of solders available from Indium to Sn/Pb depending on thermal performance requirements.

  2. Brazing: Similar to soldering, but performed at higher temperatures using a filler metal that melts and flows into the joint creating a metal-to-metal interface that results in the highest thermal conductivity between the base and the cooling fins.

  3. Epoxy Bonding: Thermally conductive epoxy adhesives are used to bond the fins to the base. This method is useful for complex shapes or materials that cannot withstand the high temperatures of soldering or brazing. It is generally the most cost-effective method of manufacturing a bonded fin heatsink.

Bonded-Fin Capabilities Chart

Feature
Inches
Metric (mm)
Notes
Minimum
Maximum
Minimum
Maximum
Base Construction
Extruded
Machined
Extruded
Machined
Extruded
Machined
Extruded
Machined
Width
1.00
1.00
19.00
60.00
25.40
25.40
482.60
1524.00
Maximum machined width currently limited by existing equipment
Flow Length
0.25
0.50
48.00
48.00
6.40
12.70
1219.20
1219.20
Flow lengths shown are practical limits. Above 48" additional design engineering required.
Fin Height
0.02
0.02
6.00
6.00
0.50
0.50
152.40
152.40
Maximum height shown is practical limit. Taller heights are capable. After this height fin efficiency decreases.
Fin Thickness
0.02
0.02
0.13
0.13
0.50
0.50
3.20
3.20
Machined bases can accommodate thicker fins, but shown is practical limit.
Fin Spacing
0.05
0.05
1.00
1.00
1.30
1.30
25.40
25.40
There is no maximum limit on fin spacing. Shown is a practical limit.
Base Thickness
0.15
0.15
1.50
3.00
3.80
3.80
38.10
76.20
Extruded maximum is limited by weight/foot property machined based thickness has no pracical limit.

Options

Fin Material Aluminum alloy : 1060, 6061, 6063
Copper alloy : C110
Base Material Aluminum alloy : 1060, 6061, 6063
Copper alloy : C110
Fin / Base Bonding Methods Thermally Conductive Epoxy
Soldering
Crimping
Brazing
Enhanced Thermal Management Options DC or AC Fans' and Blowers
Heat Pipes
Vapor Chambers
Thermal Interface Materials
Liquid Cooling Channels
Design Options Mounting Flanges or Brackets
Ducting Shrouds
Contract Manufacturing Services Electromechanical Assembly
Finishing Chem Film
Anodize
Ni Plate
Paint
Powder Coating
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