COLD PLATES
PRODUCTS
Cold Plates for Thermal Management of Electronic Systems
Cofan’s cold plates are designed for efficient liquid cooling in high-power electronics, including applications in power converters, battery management systems, and industrial automation. With design flexibility in copper, aluminum, and hybrid materials, these cold plates ensure optimal thermal contact and performance. Whether you need direct-contact cooling or modular configurations, Cofan provides custom solutions for scalable integration.
Cofan’s cooling solutions offer highly effective thermal management by ensuring direct contact with heat-intensive components, including IGBTs, CPUs, and power inverters. Once thermal energy is absorbed, it moves efficiently into a broader thermal control system—be it fluid-cooled, air-cooled, or hybrid. As a result, performance remains safe and stable even in high-demand environments.
Thanks to a flexible design approach, these cooling modules suit both custom liquid loops and OEM-integrated systems. Moreover, they find applications across diverse sectors such as computing, power electronics, automotive, and aerospace. To ensure optimal outcomes, Cofan collaborates closely with OEMs and system designers. By doing so, we deliver solutions tailored to meet exacting requirements in terms of thermal capacity, form factor, and durability. Consequently, our clients benefit from enhanced reliability and system efficiency.
Operating Principle
Cofan’s advanced cooling blocks transfer heat through direct conduction from high-power electronics into a connected thermal architecture. Because of this, they support various configurations—including liquid, air, or hybrid systems. In turn, such versatility contributes to consistent performance under heavy thermal loads.
Furthermore, the modules are engineered for modular integration. Therefore, they fit seamlessly into standalone or OEM-specific systems. In other words, engineers can implement them without requiring extensive structural revisions.
Available Types
Target Applications
Key Benefits
- Machined cold plates
- Tube-in-plate configurations
- Manifold or multi-pass flow plates
- Custom hybrid assemblies
- Designed for scalable integration into advanced electronics and industrial systems
- High-power inverters and power control units
- Industrial computing and telecom base stations
- Laser modules and RF systems
- Aerospace and automotive control systems
- Passive conduction-based design
- Compatible with cooling fluid systems
- Space-saving, lightweight form factor
- Customizable layouts, ports, and flow interfaces
- Reliable thermal performance under sustained high-power operation
- COLD PLATES IN INDUSTRIES -
Bitcoin Mining Machine
Cold plates dissipate the intense heat generated by mining rigs, improving thermal stability, preventing overheating, and extending hardware lifespan.
- Part No : 92.01.90011
UVA Battery
Cold plates regulate UAV battery temperature to reduce thermal runaway, improve safety, and extend battery life in flight-critical environments.
- Part No : 92.02.90021
Medical
Cold plates maintain temperature stability in MRI, CT, and laser systems, enabling precise imaging and safe thermal control during procedures.
- Part No : 92.03.90021
AI
Designed for high-density environments, cold plates prevent overheating in AI servers and GPUs, and support compact edge systems like AVs and smart cameras.
- Part No : 92.04.90021
IGBT Solar Module
Cold plates manage IGBT heat in solar inverters, enhancing power output, system efficiency, and long-term operational reliability.
- Part No : 92.05.90026
Electrical
Used in power electronics and control panels, cold plates ensure thermal protection for inverters, transformers, and sensitive electrical components.
- Part No : 92.06.90023
- MORE PRODUCTS -
− Cofan's cold plate Processes −
Cold Plate
Feature included
- Cost-effective design with consistently high thermal performance
- Compatible with water and a wide range of industrial coolants
- Reliable, leak-free operation for long-term use
Product Options
- Exposed Tube Cold Plate
- Multipass Exposed Tube Design
- Full Buried Cold Plate
How Liquid Cooling Systems Use Cold Plates
In liquid-cooled environments, heat spreaders such as contact modules play a key role in thermal management. Compared to conventional air-based systems, liquid circulation delivers significantly higher heat removal efficiency—especially in compact or low-airflow conditions.
In practice, a typical cold plate system consists of:
- A cold plate(for contact cooling)
- A pump
- A heat exchanger(e.g., radiator)
- Tubes or hoses for fluid circulation
Placed directly on heat-generating surfaces, the interface transfers energy into the coolant. Then, the fluid carries it to a remote exchanger, where it’s released into the surrounding air. Additionally, Cofan’s thermal components are compatible with both water and industrial coolants. Thus, they provide designers with greater flexibility to meet specific thermal and mechanical needs.
Liquid Copper Tube System - Epoxy High Performance Thermal Specifications
Note: Shelf life may vary based on storage temperature and handling conditions.
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Application Features
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Property
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Value
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Viscosity @ 25 ºC
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150,000 cPs
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Specific Gravity @ 25 ºC
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2.2 g/cc
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Shelf Life @ 25 ºC
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10 days
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Shelf Life @ 0 ºC
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6 momths
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Curing Procedures
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Curing Temperature
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Curing Time
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100 ºC
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4 hours
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125 ºC
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2 hours
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155 ºC
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30 minutes
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170 ºC
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5 minutes
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Curing Procedures
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Chemical Type
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Epoxy
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Test Method
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Appearance Uncured
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Gray Paste
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Visual
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Appearance Cured
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Dull Gray Solid
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Visual
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Components
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One component
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****
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Heat Capacity
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0.7 l/g-K
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ASTM C351
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Key Substrates
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Metal, Ceramics
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****
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Hardness
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92 Shore A
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ASTM 2240
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Continuous Use Temp
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-40 to 180 ºC
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****
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Tensile Strength AI/AI @ 25 ºC
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> 2900 psi
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****
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Thermal Conductivity
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4.5 W/m-k
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ASTM D5470
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