COFAN THERMAL

PCB CAPABILITIES

With 25 years of experience leading and innovating within the thermal management industry, COFAN will find the right solution whether you need a single-layer or multi-layered PCB design. COFAN supports you from the prototype stage to the production stage while keeping costs low due to our facilities in Taiwan and China.

COFAN also offers MCPCBs (metal-core printed circuit boards), which are PCBs with a heat sink incorporated into the PCB. It reduces thermal resistance by making use of dielectric polymer pre-preg, transferring heat 8-12 times faster than a conventional FR4 PCB.

COFAN is able to customize your PCB/MCPCB designs, regardless of the number of layers. Vias can also be customized, whether it’s thermal vias, filled vias, blind vias, or a combination of the three. Our dielectric polymer pre-preg materials offer some of the best thermal management properties for LED lighting, DC-DC power, and military applications.

All of our materials are UL-approved to ensure safety and accountability. For extreme LED lighting applications, we would recommend our unique and patented Super Pillar technology, which allows for thermal conductivity up to 300W/mK. Finally, we also offer bendable or non-rigid materials for applications that require unique shapes and angles for LED lighting.

At COFAN, we use our in-house facilities to ensure quick manufacturing lead times and a high-quality product—we pride ourselves on delivering products on time and free of defects.

MCPCB CAPABILITIES

Single Sided Capabilities
Single sided with metal base
Wide selection of thermally conductive pre-preg
Fully automated production line for competitive pricing
Double Sided Capabilities
Single-sided SMT with metal base
Surface mounting on the top layer with all connections done on Layer 2
More room, more BOM, more functions
Multi Layer Capabilities
Single sided SMT with metal base
Surface mounting on the top layer with all connections done on layers 2 and 3, with EMI on layer 4
Thermal and electric vias
Chassis vias

FR4 CAPABILITIES

General Capabilities
Single sided
Impedance controlled
Double-sided
Micro vias
Multilayer
Laser drilling
Buried vias
RoHS compliance
Blind vias
Epoxy filled vias
Special Capabilities
Attribute: see (*) below as applies
S/Sided
D/Sided
Multilayer
Advanced
Minimum Line/Spacing, Internal Layer
N/A
N/A
.004”/.004”
003”/.003”
Minimum Line/Spacing, External Layer
.007”/.008”
007”/.008”
.005”/.005”
.003”/.003”
Aspect Ratio (Thickness to Drill)
6:1
6:1
8:1
10:1
Minimum Drilled Hole Size
.010”
.008”
.008”
.008”
Land Size Internal (Diameter Over Drill)
N/A
N/A
.015”
.012”
Land size External (Diameter Over Drill)
.012”
.012”
.012”
.010”
Plane Clearance (Diameter Over Drill)
.030”
.030”
.030”
.024”
Plated Hole Tolerance
+/- .003”
+/- .003”
+/- .003”
+/- .003”
Minimum Dielectric Thickness
N/A
N/A
.0025”
.002”
Minimum Core Thickness
N/A
N/A
.004”
.003”
Minimum PCB Thickness **
.017”
.018”
.020”
.020”
Maximum PCB Thickness
.125”
.125”
.250”
.250”
Thickness Tolerance (%)
+/- 10
+/- 10
+/- 10
+/- 5
Maximum Board Dimensions *
16” x 52” *
19” x 22” *
17” x 23”
17” x 23”
Fabrication Tolerances (overall dimension)
+/- .010”
+/- .010”
+/- .010”
+/- .005”
Bow and Twist (Through Hole) %
1.5
1.5
1.5
1
Bow and Twist (SMT) %
.75
.75
.75
.75
Minimum Conductor to Edge
.015”
.015”
.015”
.010”
Layer to Layer Registration Tolerance
N/A
.004”
.004”
.003”
Component Pitch
.025”
.025”
.025”
.015”
Soldermask Clearance
.005”
.005”
.005”
.004”
Soldermask Dams
.005”
.005”
.005”
.004”
Impedance Tolerance (>50 Ohms) %
+/- 10
+/- 10
+/- 10
+/- 8
Maximum Layers
1
1
12
16
Minimum Copper Weight Inners (oz.)
N/A
N/A
1/4
Maximum Copper Weight Int. Ground (oz.)
N/A
N/A
3
8
Maximum Copper Weight Int. Signal (oz.)
N/A
N/A
2
6
Maximum Copper Weight Ext. Ground (oz.)
4
4
2
10
Maximum Copper Weight Ext. Signal (oz.)
4
4
3
10
Atomic Number
Chemical Symbol
Element Name
1
H
Hydrogen
2
He
Helium
3
Li
Lithium
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