DirecT-to-chip COLD PLATES
PRODUCTS
− Direct-to-Chip Liquid Cold Plates −
Custom CPU & GPU Liquid Cooling Solutions for AI, HPC & Data Centers
As processors continue to increase in power and thermal density, conventional air cooling is reaching its practical limits.
Cofan Thermal develops high-performance Direct-to-Chip (D2C) liquid cold plates engineered to efficiently remove heat directly from CPUs, GPUs, AI accelerators, and other high-power electronic devices.
From thermal analysis and CFD simulation to prototyping, testing, and manufacturing, Cofan provides a complete engineering solution tailored to each application.
Engineered. Simulated. Tested. Manufactured by Cofan.
Why Direct-to-Chip Liquid Cooling?
Next-generation AI, HPC, and data center systems are driving unprecedented levels of processor power and heat density.
Direct-to-Chip liquid cooling transfers heat from the processor directly into a circulating coolant through a precision-engineered cold plate. This provides significantly greater heat-removal capability than conventional air-cooled solutions and enables more efficient cooling of high-power processors.
Key Benefits
- High heat-removal capability
- Efficient cooling of high-power CPUs and GPUs
- Reduced processor operating temperatures
- Improved thermal stability
- Reduced risk of thermal throttling
- Higher compute and rack density
- Reduced dependence on high-volume airflow
- Optimized cooling for 24/7 operation
− Intel® LGA4677 Direct-to-chip cold plate −
High-Performance Cooling for Server & Data Center Applications
Cofan’s Intel LGA4677 liquid cold plate is designed for high-performance server and computing applications requiring efficient thermal management under demanding operating conditions.
The cold plate uses an optimized internal liquid-flow path to transfer heat from the processor into the circulating coolant while maintaining controlled flow resistance.
Key Features
- Designed for Intel LGA4677 processor platforms
- High thermal conductivity cold plate construction
- Optimized internal coolant channels
- Uniform flow distribution across the heat source
- Low thermal resistance
- Controlled pressure drop
- Robust mechanical mounting
- Leak-tested construction
- Custom fittings and tubing configurations available
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Test Parameter
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Value
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Heat Load
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Approx. 600 W
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Coolant Inlet Temperature
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35°C ±0.5°C
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Coolant Flow Rate
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Approx. 2.2 L/min
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Test Duration
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Up to 60 minutes
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Testing demonstrated stable thermal performance under continuous high-power operation.
− AMD SP5 direct-to-chip cold plate −
Cofan also develops Direct-to-Chip liquid cold plates for AMD SP5 server processor platforms.
Cold plate geometry, internal flow channels, mounting interfaces, and coolant connections can be optimized according to processor heat load, system mechanical constraints, coolant conditions, and required thermal performance.
Key Features
- Designed for AMD SP5 processor platforms
- High-performance liquid cooling
- Optimized coolant flow path
- High thermal conductivity materials
- Custom inlet and outlet configurations
- Mechanical mounting designed for server applications
- Leak-tested construction
- Prototype and production support
Performance testing and customized configurations are available based on customer thermal and mechanical requirements.
Custom GPU Cold Plates for AI Servers
Liquid Cooling for High-Power GPUs & AI Accelerators
The rapid growth of Artificial Intelligence and High-Performance Computing is creating increasingly demanding thermal challenges.
Cofan develops custom GPU cold plates for high-power GPUs, AI accelerators, ASICs, FPGAs, and other advanced computing devices.
Rather than applying a one-size-fits-all design, each cold plate can be optimized around the customer’s processor, thermal load, mechanical envelope, and liquid cooling system.
GPU Cold Plate Design Parameters
Our engineers can optimize cold plate designs based on:
- GPU or accelerator heat load
- Heat-source size and heat-flux distribution
- Processor package dimensions
- Available mechanical envelope
- Coolant type
- Coolant inlet temperature
- Required flow rate
- Maximum allowable pressure drop
- Mounting interface
- Inlet and outlet locations
- Fitting requirements
- System-level cooling requirements
Application
- AI Servers
- GPU Servers
- AI Accelerators
- High-Performance Computing (HPC)
- Machine Learning Infrastructure
- Data Centers
- Cloud Computing
- High-Density Computing
- Edge Computing
- Industrial Computing
Custom Cold Plate Solutions
Engineered with CFD. Validated with Testing
A high-performance cold plate requires more than machining a flow channel into a metal plate.
The internal channel geometry must provide effective heat transfer while maintaining uniform coolant distribution and acceptable pressure drop.
Cofan combines thermal engineering, CFD simulation, manufacturing, and physical testing to develop optimized liquid cooling solutions.
Our engineering process begins by understanding the application’s operating requirements.
Typical inputs include:
- Processor or device heat load
- Heat-source dimensions
- Heat-flux distribution
- Maximum allowable temperature
- Coolant type and temperature
- Target flow rate
- Pressure-drop limits
- Mechanical envelope
- Mounting requirements
Computational Fluid Dynamics (CFD) and thermal simulation can be used to evaluate and optimize:
- Coolant flow distribution
- Internal channel geometry
- Fluid velocity
- Temperature distribution
- Hot spots
- Heat transfer
- Pressure drop
- Overall thermal performance
After design optimization, prototypes can be manufactured and evaluated through physical testing.
Depending on project requirements, validation can include:
- Thermal performance testing
- Flow-rate testing
- Pressure-drop testing
- Leak testing
- Mechanical inspection
- Dimensional verification
Once the design has been validated, Cofan can support the transition from prototype to production.
Our engineering and manufacturing teams work together to ensure that the production design maintains the required thermal performance, mechanical integrity, and manufacturability.
Custom Cold Plate Engineering
Every thermal application is different.
Cofan provides customized cold plate solutions based on customer-specific thermal, mechanical, and system requirements.
- Materials : Copper, aluminum, and application-specific material configurations.
- Internal Channel Design : Flow paths can be optimized for heat transfer, coolant distribution, and pressure drop.
- Mechanical Interface : Cold plate dimensions and mounting features can be customized to match the processor, PCB, server, or system architecture.
- Fluid Connections : Custom fitting types, sizes, locations, and inlet/outlet orientations are available.
- Cooling Requirements : Designs can be optimized around customer-specified coolant, flow rate, inlet temperature, pressure drop, and thermal targets.
- Prototype to Production : Cofan supports projects from initial concept and prototype development through qualification and volume manufacturing.
Direct-to-Chip Cooling Applications
Cofan Direct-to-Chip cold plates can be developed for a wide range of high-performance computing and electronics applications.
- Cofan Direct-to-Chip cold plates can be developed for a wide range of high-performance computing and electronics applications.
- Liquid cooling solutions for high-density server and rack architectures.
- CPU and GPU cooling for scientific, engineering, research, and simulation workloads.
- Thermal solutions designed for continuously operating high-density compute infrastructure.
- Liquid cooling for high-power processors and next-generation networking hardware.
- Customized cold plates for high-power electronics operating in demanding thermal environments.
From Thermal Challenge to Production Solution
Cofan provides more than a cold plate.
We combine thermal engineering and manufacturing capabilities to help customers develop cooling solutions from initial concept through production.
Thermal Requirements → CFD Simulation → Cold Plate Design → Prototype → Testing → Production
This integrated approach allows thermal performance, mechanical requirements, and manufacturability to be considered throughout the development process.
Start Your Cold Plate Project
Please provide as much of the following information as available:
- 2D drawing or 3D model
- CPU / GPU / device information
- Package dimensions
- Heat load (W)
- Heat-source map, if available
- Maximum allowable device temperature
- Coolant type
- Coolant inlet temperature
- Target coolant flow rate
- Maximum allowable pressure drop
- Available mechanical envelope
- Mounting requirements
- Inlet / outlet requirements
- Prototype quantity
- Estimated production quantity
Not all information needs to be available at the beginning of a project. Our engineering team can work with you to define the remaining thermal and mechanical requirements.